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? 2016 microchip technology inc. ds20005629a-page 1 hv5812 features ?hvcmos ? technology for high performance ? operating voltage of up to 80v ? high-speed source driver ? 5v cmos logic circuitry ? up to 5 mhz data input rate ? excellent noise immunity ? flexible high-voltage supplies applications ? display driver general description the hv5812 is a 20-channel serial-input vacuum fluore scent display driver. it combines a 20-bit cmos shift register, data latche s and control circuitry with high-voltage mosfet outputs. the hv5812 is primari ly designed for vacuum fluorescent displays. the cmos shift register and latches allow direct interfacing with mi croprocessor-based system s. data input rates are typically over 5 mhz with 5v logic supply. especially useful for interdigit blanking, the blanking input disables the output source drives and turns on the sink drivers. using with ttl may require external pull-up resistors to ensure an input logic high. package type 28-lead pdip (top view) see table 2-1 for pin information. 28 1 1 28 4 26 1 28 28-lead plcc (top view) 28-lead sow (top view) s 20-channel serial-input vacuum fluorescen t display driver for anode or grid
bl strobe data in clk data out 20-bit shift register 20-bit latch vpp hv out 1 hv out 2 hv out 3 hv out 20 gnd vdd hv5812 ds20005629a-page 2 ? 2016 microchip technology inc. functional block diagram ?
? 2016 microchip technology inc. ds20005629a-page 3 hv5812 1.0 electrical characteristics absolute maximum ratings? supply voltage, v dd ............................................................................................................................... . ?0.5v to +7.5v supply voltage, v pp .................................................................................................................................. ?0.5v to +90v logic input levels ........................................... ... ............................................................... ............... ?0.3v to v dd +0.3v maximum operating junction temperature .................. ... .................................................................... ................+125c storage temperature ............................................................................................................ ................ ?55 c to +150c power dissipation: 28-lead pdip ................................................................................................................... . ..................... 2000 mw 28-lead plcc................................................................................................................... .. ................... 1900 mw 28-lead sow.................................................................................................................... . ................... 1700 mw ? notic e: stresses above those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. exposure to maximum rating conditions for extended periods may affect device reliability. recommended operating conditions parameter sym. min. typ. max. unit conditions supply voltage v dd 4.5 ? 5.5 v supply voltage v pp 20 ? 80 v operating junction temperature t j ?40 ? +125 c dc electrical characteristics electrical specifications : over recommended operating conditions; t a = 25c unless otherwise indicated. parameter sym. min. typ. max. unit conditions output leakage current i dss ? ?5 ?15 a v out = 0v, t a = +70c high-level output v oh hv out 78 78.5 ? v i out = ?25 ma, v pp = 80v, ? t j = +25c 77 78 ? i out = ?25 ma, v pp = 80v, ? t j = +125c data out 4.5 4.7 ? v i out = ?200 a, v dd = 5v low-level output v ol hv out ? 1.5 3 v i out = 1 ma, t j = +25c, v dd = 5v ? 2.3 4 i out = 1 ma, t j = +125c, v dd = 5v data out ? 200 250 v i out = +200 a, v dd = 5v output pull-down current i sink 2 3.5 ? ma v out = 5v to v pp , v dd = 5v high-level logic input voltage v ih 3.5 ? 5.3 v v dd = 5v low-level logic input voltage v il ?0.3 ? 0.8 v high-level logic input current i ih ? 0.05 0.5 a v in = v dd , v dd = 5v low-level logic input current i il ? ?0.05 ?0.5 a v in = 0.8v, v dd = 5v quiescent v dd supply current i ddq ? 100 300 a all outputs high, v dd = 5v ? 100 300 all outputs low, v dd = 5v quiescent v pp supply current i ppq ? 10 100 a all outputs high, no load ? 10 100 all outputs low, no load
ac electrical characteristics electrical specifications : over recommended operating conditions; t a = 25c unless otherwise indicated. parameter sym. min. typ. max. unit conditions blanking to output delay t phl ? 2000 ? ns c l = 30 pf, 50% to 50%, v dd =5v t plh ? 1000 ? output fall time t r ? 1450 ? ns c l = 30 pf, 90% to 10%, v dd = 5v output rise time t f ? 650 ? ns c l = 30 pf, 10% to 90%, v dd = 5v data set-up time t su 75 ? ? ns see timing waveforms . data hold time t h 75 ? ? ns see timing waveforms . minimum data pulse width t pwd 150 ? ? ns see timing waveforms . minimum clock pulse width t pwclk 150 ? ? ns see timing waveforms . minimum time between clock acti vation and strobe t cks 300 ? ? ns see timing waveforms . minimum strobe pulse width t pws 100 ? ? ns see timing waveforms . typical time between strobe act ivation and output transition t sto ? 500 ? ns see timing waveforms . maximum clock frequency f clk ? 8 ? mhz t j = +25c, v dd = 5v ? 5 ? t j = +125c, v dd = 5v temperature specifications parameter sym. min. typ. max. unit conditions temperature range operating junction temperature t j ?40 ? +125 c storage temperature t s ?55 ? +150 c package thermal resistance 28-lead pdip ? ja ? 43 ? c/w 28-lead plcc ? ja ? 48 ? c/w 28-lead sow ? ja ? 55 ? c/w hv5812 ds20005629a-page 4 ? 2016 microchip technology inc.
? 2016 microchip technology inc. ds20005629a-page 5 hv5812 timing waveforms clk data in strobe bl hv out t pwclk t pws t phl t f t r t plh t su 50% 90% 10% 50% 10% t h t pwd t cks t sto 90% 50% 50% 50% 50% 50% 50% v ih v il v ih v il v ih v il v ih v il v oh v ol 50% 50%
hv5812 ds20005629a-page 6 ? 2016 microchip technology inc. 2.0 pin description the details on the pins of hv5812 28-lead pdip, 28-l ead plcc and 28-lead sow are listed on table 2-1 . refer to package types for the location of pin s. table 2-1: pin function table pin number pin name description 1 vpp high-voltage power rail 2 data out serial data output. data output for cascadi ng to the data input of the next device. 3 hv out 20 high-voltage output 4 hv out 19 high-voltage output 5 hv out 18 high-voltage output 6 hv out 17 high-voltage output 7 hv out 16 high-voltage output 8 hv out 15 high-voltage output 9 hv out 14 high-voltage output 10 hv out 13 high-voltage output 11 hv out 12 high-voltage output 12 hv out 11 high-voltage output 13 blanking blank 14 gnd logic and high-voltage ground 15 clock data shift register clock 16 strobe strobe 17 hv out 10 high-voltage output 18 hv out 9 high-voltage output 19 hv out 8 high-voltage output 20 hv out 7 high-voltage output 21 hv out 6 high-voltage output 22 hv out 5 high-voltage output 23 hv out 4 high-voltage output 24 hv out 3 high-voltage output 25 hv out 2 high-voltage output 26 hv out 1 high-voltage output 27 data in serial data input 28 vdd low-voltage logic power rail
? 2016 microchip technology inc. ds20005629a-page 7 hv5812 3.0 functional description follow the steps below to power up and power down the hv5812 : power-up and power-down sequence power-up power-down step description step description 1 connect ground. 1 remove v pp . 2 apply v dd . 2 remove all inputs. 3 set all inputs (data, clk, etc.) to a known state 3 remove v dd . 4 apply v pp . ( note 1 ) 4 disconnect ground. note 1: th e v pp should not drop below v dd during operation. function table ( note 1 ) serial data input clock inp ut shift register contents serial dat a output strobe inp ut latch contents blanking output contents i 1 i 2 i 3 ... i n-1 i n i 1 i 2 i 3 ... i n-1 i n i 1 i 2 i 3 ... i n-1 i n h l to h h r 1 r 2 ...r n?2 r n?1 r n?1 ? ? ? ? ? ? ? ? ? ? l l to h l r 1 r 2 ...r n?2 r n?1 r n?1 ? ? ? ? ? ? ? ? ? ? x h to l r 1 r 2 r 3 ...r n?1 r n r n ? ? ? ? ? ? ? ? ? ? ? ? x x x...x x x l r 1 r 2 r 3 ...r n?1 r n ? ? ? ? ? ? ? p 1 p 2 p 3 ...p n?1 p n p n h p 1 p 2 p 3 ...p n?1 p n l p 1 p 2 p 3 ...p n?1 p n ? ? ? ? ? ? ? ? x x x...x x h l l l...l l note 1: l = low logic level ? h = high logic level ? x = irrelevant ? p = present state ? r = previous state , vdd input gnd vpp l/t gnd hv out logic inputs gnd data out logic data output high voltage outputs vdd figure 3-1: io circuits.
hv5812 ds20005629a-page 8 ? 2016 microchip technology inc. 4.0 package marking information 4.1 packaging information 28-lead pdip example hv5812p e 3 1625859 xxxxxx e 3 yywwnnn legend: xx...x product code or cust omer-specific information ? y year code (last digit of calendar year) ? yy year code (last 2 digits of calendar year) ? ww week code (week of january 1 is week ?01?) ? nnn alphanumeric traceability code ? pb-free jedec ? designator for matte tin (sn) ? * this package is pb-free. the pb-free jedec designator ( ) ? can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for product code or customer-specific information. package may or not include the corporate logo. 3 e 3 e xxxxxxx e 3 yywwnnn e 3 hv5812wg 1678896 28-lead sow example 28-lead plcc example xxxxxxxxx yywwnnn e 3 hv5812pj 1611231 e 3
28-lead pdip (.600in row spacing) package outline (p) 1.565x.580in body, .250in height (max), .100in pitch note 1 (index area) 28 1 d l a1 a a2 seating plane e e1 d1 d1 e a a side view top view view a - a ea eb b b1 view b view b note: 1. $3lqlghqwl?hupxvwehorfdwhglqwkhlqgh[duhdlqglfdwhg7kh3lqlghqwl?hufdqehdproghgpdunlghqwl?hudqhpehggh gphwdopdunhuru dsulqwhglqglfdwru symbol a a1 a2 b b1 d d1 e e1 e ea eb l dimension (inches) min .140* .015 .125 .014 .030 1.380 .065 ? .590 ? .485 .100 bsc .600 bsc .600* .115 nom------ - -- -- max .250 .055* .195 .023 ? .070 1.565 .085* .625 .580 .700 .200 -('(&5hjlvwudwlrq069duldwlrq$%,vvxh%-xqh 7klvglphqvlrqlvqrwvshfl?hglqwkh-('(&gudzlqj ?7klvglphqvlrqgliihuviurpwkh-('(&gudzlqj drawings not to scale. note: for the most current package drawings, see the microchip packaging specification at www.microchip.com/packaging. note: for the most current package drawings, see the microchip packaging specification at www.microchip.com/packaging. ? 2016 microchip technology inc. ds20005629a-page 9 hv5812
28-lead plcc package outline (pj) .453x.453in. body, .180in. height (max), .050in. pitch symbol a a1 a2 b b1 d d1 e e1 e r dimension (inches) min .165 .090 .062 .013 .026 .485 .450 .485 .450 .050 bsc .025 nom .172 .105 - - - .490 .453 .490 .453 .035 max .180 .120 .083 .021 .032 .495 .456 .495 .456 .045 jedec registration ms-018, variation ab, issue a, june, 1993. drawings not to scale . .150 max .048/.042 x 45 o 1 075 max 4 26 d d1 e1 e top view view a a a2 a1 seating plane e note 1 (index area) .056/.042 x 45 o base plane .020 min 28 b view a b1 horizontal side view vertical side view note 2 .020max (3 places) r notes: 1. $3lqlghqwl?hupxvwehorfdwhglqwkhlqgh[duhdlqglfdwhg7kh3lqlghqwl?hufdqehdproghgpdunlghqwl?hudqhpehggh gphwdopdunhuru a printed indicator. 2. $fwxdovkdshriwklvihdwxuhpd\ydu\ note: for the most current package drawings, see the microchip packaging specification at www.microchip.com/packaging. note: for the most current package drawings, see the microchip packaging specification at www.microchip.com/packaging. hv5812 ds20005629a-page 10 ? 2016 microchip technology inc.
28-lead sow (wide body) package outline (wg) 17.90x7.50mm body, 2.65mm height (max), 1.27mm pitch symbol a a1 a2 b d e e1 e h l l1 l2 dimension (mm) min 2.15* 0.10 2.05 0.31 17.70* 9.97* 7.40* 1.27 bsc 0.25 0.40 1.40 ref 0.25 bsc 0 o 5 o nom - - - - 17.90 10.30 7.50 - - - - max 2.65 0.30 2.55* 0.51 18.10* 10.63* 7.60* 0.75 1.27 8 o 15 o jedec registration ms-013, variation ae, issue e, sep. 2005. 7klvglphqvlrqlvqrwvshfl?hglqwkh-('(&gudzlqj drawings are not to scale. s# s 28so g 0 1309 d seating plane gauge plane l l1 l2 top view side view view b view b 1 e1 e a a2 a1 a a seating plane e b h h 28 1 note 1 note 1 (index area 0.25d x 0.75e1) view a - a note: 1. $3lqlghqwl?hupxvwehorfdwhglqwkhlqgh[duhdlqglfdwhg7kh3lqlghqwl?hufdqehdproghgpdunlghqwl?hudqhpehggh gphwdopdunhuru a printed indicator. note: for the most current package drawings, see the microchip packaging specification at www.microchip.com/packaging. note: for the most current package drawings, see the microchip packaging specification at www.microchip.com/packaging. ? 2016 microchip technology inc. ds20005629a-page 11 hv5812
hv5812 ds20005629a-page 12 ? 2016 microchip technology inc. notes:
? 2016 microchip technology inc. ds20005629a-page 13 hv5812 appendix a: revision history revision a (october 2016) ? converted supertex doc# dsfp- hv5812 to microchip ds20005629a ? changed the packaging quantity of 28-lead plcc (pj m904) from 500/reel to 750/reel and 28-lead sow (wg) from 1000/reel to 1600/reel ? made minor text changes throughout the docu - ment
hv5812 ds20005629a-page 14 ? 2016 microchip technology inc. product identification system to order or obtain information, e.g., on pricing or delivery, contact your local microchip r epresentative or sales office . examples: a) hv5812p-g: 20-channel serial-input vacuum fluorescent display driver for anode or grid, 28-lead pdip, 13/tube b) hv5812pj-g: 20-channel serial-input vacuum fluorescent display driver for anode or grid, 28-lead plcc, 38/tube c) HV5812PJ-G-M904: 20-channel serial-input vacuum fluorescent display driver for anode or grid, 28-lead plcc, 750/reel d) hv5812wg-g: 20-channel serial-input vacuum fluorescent display driver for anode or grid, 28-lead sow, 1600/reel part no. device device: hv5812 = 20-channel serial-input vacuum fluorescent display driver for anode or grid packages: p = 28-lead pdip pj = 28-lead plcc wg = 28-lead sow environmental: g = lead (pb)-free/rohs-compliant package media types: (blank) = 13/tube for a p package = 38/tube for a pj package = 1600/reel f or a wg package m904 = 750/reel for a pj package xx package - x - x environmental media type options
? 2016 microchip technology inc. ds20005629a-page 15 information contained in this publication regarding device applications and the like is prov ided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application me ets with your specifications. microchip makes no re presentations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safe ty applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting fr om such use. no licenses are conveyed, implicitly or ot herwise, under any microchip intellectual property rights unless otherwise stated. trademarks the microchip name and logo, the microchip logo, anyrate, dspic, flashflex, flexpwr, heldo, jukeblox, keeloq, keeloq logo, kleer, lancheck, link md, medialb, most, most logo, mplab, optolyzer, pic, picstart, pic32 logo, righttouch, spynic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. clockworks, the embedded control solutions company, ethersynch, hyper speed control, hyperlight load, intellimos, mtouch, precision edge, and quiet-wire are registered trademarks of microc hip technology incorporated in the u.s.a. analog-for-the-digital age, any capacitor, anyin, anyout, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dynamic average matching, dam, ecan, ethergreen, in-circuit serial programming, icsp, inter-chip connectivity, jitterblocker, kleernet, kleernet logo, miwi, motorbench, mpasm, mpf, mplab certified logo, mplib, mplink, multitrak, netdetach, omniscient code generation, picdem, picdem.net, pickit, pictail, puresilicon, righttouch logo, real ice, ripple blocker, serial quad i/o, sqi, superswitcher, superswitcher ii, total endurance, tsharc, usbcheck, varisense, viewspan, wiperlock, wireless dna, and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. gestic is a registered tradem arks of microchip technology germany ii gmbh & co. kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2016, microchip technology incorporated, printed in the u.s.a., all rights reserved. isbn: 978-1-5224-0999-1 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal meth ods used to breach the code protection fe ature. all of these methods, to our knowledge, require using the microchip pr oducts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your softwa re or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microper ipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem by dnv == iso/ts 16949 ==
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